During the intense global demand and rapid technological scaling for semiconductor products, recognizing these shifting market dynamics, General Precision began planning its transition toward semiconductor markets that would define its strategy in the coming decades. The groundwork laid during the latter part of the 1980s—strengthened manufacturing processes, enhanced research and development capabilities, and financial discipline—positioned the company to pursue this strategic shift. To meet increasing demand, General Precision built two state-of-the-art large manufacturing facilities for the production of clean rooms and fab automation. We partner with IBM, INTEL, MOTOROLA, Nikon, and many other fabs in the USA.
During the 1990s, the company partnered with many fabs globally, including TSMC Taiwan, IBM France, Japan, China, Singapore, Italy, and many other global fabs.
General Precision was the most advanced and biggest company in the world in supporting the fabs with the newest technology of 450mm wafer processing.
| Class | FED STD 209E Equivalent |
Maximum concentration limits (particles/m³ of air) for particles equal to and larger than the sizes listed below | |||||
|---|---|---|---|---|---|---|---|
| 0.1 micron | 0.2 micron | 0.3 micron | 0.5 micron | 1 micron | 5 micron | ||
| ISO 1 | 10 | 2 | |||||
| ISO 2 | 100 | 24 | 10 | 4 | |||
| ISO 3 | 1 | 1,000 | 237 | 102 | 35 | 8 | |
| ISO 4 | 10 | 10,000 | 2,370 | 1,020 | 352 | 83 | |
| ISO 5 | 100 | 100,000 | 23,700 | 10,200 | 3,520 | 832 | 29 |
| ISO 6 | 1,000 | 1,000,000 | 237,000 | 102,000 | 35,200 | 8,320 | 293 |
| ISO 7 | 10,000 | 352,000 | 83,200 | 2,930 | |||
| ISO 8 | 100,000 | 3,520,000 | 832,000 | 29,300 | |||
| ISO 9 | 8,320,000 | 293,000 | |||||